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| CYStech Electronics Corp. High voltage switching (double) diodes Spec. No. : C335N3 Issued Date : 2003.05.30 Revised Date : Page No. : 1/4 CMBD2004/A/C/SN3 Description High voltage switching diodes encapsulated in a SOT-23 small plastic SMD package. Single diodes and double diodes with different pinning are available. Features *Fast switching speed *Low forward voltage drop *Small plastic SMD package Mechanical Data *Case : SOT-23, molded plastic *Terminals : Solderable per MIL-STD-202 Method 208 *Weight : 0.008 grams(approx.) Pinning Pin 1 2 3 Description CMBD2004 CMBD2004A CMBD2004C CMBD2004S A K1 A1 A1 NC K2 A2 K2 K A1,A2 K1,K2 K1,A1 Outline SOT-23 3 1 2 (1) CMBD2004 (2)CMBD2004A Marking: Type CMBD2004 N3 CMBD2004AN3 CMBD2004CN3 CMBD2004SN3 Marking Code D53 DB8 DB7 DB6 (3)CMBD2004C (4)CMBD2004S Diode configuration and symbol CMBD2004/A/C/SN3 CYStek Product Specification CYStech Electronics Corp. Absolute Maximum Ratings(Ta=25, unless otherwise specified) Spec. No. : C335N3 Issued Date : 2003.05.30 Revised Date : Page No. : 2/4 * Maximum Temperatures Storage Temperature Tstg ................................................................................................... -65~+150 C Junction Temperature Tj ............................................................................................................. +150 C * Maximum Power Dissipation Total Power Dissipation Ptot (Note)........................................................................................... 350 mW * Maximum Voltages and Currents Repetitive Peak Reverse Voltage VRRM ............................................................................................ 300 V DC Blocking Voltage VR...................................................................................... 240V RMS Reverse Voltage VR(RMS)................................................................................ 170V Continuous Forward Current IF (Note)..................................................................... 225 mA Peak Repetitive Forward Current IFRM (Note)............................................................625 mA. Surge Non-repetitive Forward Current IFSM @ tp=1s ........................................................................ 4A @ tp=1s........................................................ 1A * Thermal Resistance, Junction to Ambient Air RJA....................................................357/W Note : Parts mounted on FR-4 board. For double diodes, Ptot is the total power dissipation of both diodes. Characteristics (Ta=25C) Characteristic Reverse Breakdown Voltage Forward Voltage (Note) Symbol VBR VF(1) VF(2) IR(1) IR(2) CD trr Condition IR=100A IF=20mA IF=100mA VR=240V,Tj=25 VR=240V,Tj=150 VR=0V, f=1MHz IF=IR=30mA RL=100 measured at IR=3mA Min. 300 - Max. 870 1000 100 100 5 50 Unit V mV mV nA A pF ns Reverse Leakage Current (Note) Diode Capacitance Reverse Recovery Time Notes: Pulse test, tp=380s, duty cycle<2%. CMBD2004/A/C/SN3 CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Forward Characteristics 1000 F(mA) Spec. No. : C335N3 Issued Date : 2003.05.30 Revised Date : Page No. : 3/4 Reverse Leakage Current vs Junction Temperature 100 Reverse Leakage Current---I R(A) Instantaneous Forward Current---I 100 10 10 1 1 0.1 0.1 0.01 0 1 Instantaneous Forward Voltage---VF(V) 2 0.01 0 100 Junction Temperature---Tj() 200 Power Derating Curve 400 350 Power Dissipation---PD(mW) 300 250 200 150 100 50 0 0 50 100 150 200 Ambient Temperature---TA() CMBD2004/A/C/SN3 CYStek Product Specification CYStech Electronics Corp. SOT-23 Dimension Diagram: L 3 B 1 2 S Spec. No. : C335N3 Issued Date : 2003.05.30 Revised Date : Page No. : 4/4 A Marking: L4_ DXX V G C D K 3-Lead SOT-23 Plastic Surface Mounted Package. CYStek Package Code: N3 J H * CMBD2004 N3 : Single Diode (Marking Code D53) * CMBD2004AN3 : Common Anode. (Marking Code DB8) * CMBD2004CN3 : Common Cathode. (Marking Code DB7) * CMBD2004SN3 : Series Connected. (Marking Code DB6) *: Typical DIM A B C D G H Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.85 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. CMBD2004/A/C/SN3 CYStek Product Specification |
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